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Chemical content 74LVC132ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC132ABQSOT762-1DHVQFN1421.77541 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935282822115912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43406
PolymerResin systemProprietary0.0234819.900000.10784
subTotal0.11800100.000000.54190
DieDoped siliconSilicon (Si)7440-21-30.15686100.000000.72033
subTotal0.15686100.000000.72033
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.69816
Iron (Fe)7439-89-60.205522.346100.94381
Phosphorus (P)7723-14-00.002650.030200.01215
Zinc (Zn)7440-66-60.008890.101500.04083
Pure metal layerGold (Au)7440-57-50.002650.030200.01215
Nickel (Ni)7440-02-00.106921.220500.49099
Palladium (Pd)7440-05-30.004910.056000.02253
Silver (Ag)7440-22-40.001800.020500.00825
subTotal8.76000100.0000040.22887
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69532
FillerSilica -amorphous-7631-86-90.442743.490002.03322
Silica fused60676-86-010.7602784.8200049.41475
PigmentCarbon black1333-86-40.020300.160000.09321
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62919
Epoxy resin systemProprietary0.201711.590000.92631
Phenolic resinProprietary0.285442.250001.31081
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15556
subTotal12.68600100.0000058.25837
WirePure metalCopper (Cu)7440-50-80.0526896.550000.24190
Pure metal layerGold (Au)7440-57-50.000190.350000.00088
Palladium (Pd)7440-05-30.001693.100000.00777
subTotal0.05456100.000000.25055
total21.77541100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.