Chemical content 74LVC161BQ

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Type numberPackagePackage descriptionTotal product weight
74LVC161BQSOT763-1DHVQFN1621.95428 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352756121151412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29553
PolymerResin systemProprietary0.0161219.900000.07342
DieDoped siliconSilicon (Si)7440-21-30.27488100.000001.25206
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.73118
Iron (Fe)7439-89-60.237082.320001.07988
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03724
Zinc (Zn)7440-66-60.012260.120000.05586
Gold alloyGold (Au)7440-57-50.003060.029970.01395
Silver (Ag)7440-22-40.002040.019980.00930
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02325
Nickel (Ni)7440-02-00.130671.278720.59520
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50018
FillerSilica -amorphous-7631-86-90.395003.490001.79919
Silica fused60676-86-09.5999384.8200043.72691
PigmentCarbon black1333-86-40.018110.160000.08248
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55677
Epoxy resin systemProprietary0.179961.590000.81969
Phenolic resinProprietary0.254662.250001.15993
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90745
WirePure metalCopper (Cu)7440-50-80.0592896.550000.27002
Pure metal layerGold (Au)7440-57-50.000210.350000.00098
Palladium (Pd)7440-05-30.001903.100000.00867
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.