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Chemical content 74LVC1G00GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G00GV-Q100SOT753SO510.40347 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299283125412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07209
PolymerResin systemProprietary0.0025025.000000.02403
subTotal0.01000100.000000.09612
DieDoped siliconSilicon (Si)7440-21-30.08119100.000000.78040
subTotal0.08119100.000000.78040
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.66915
Iron (Fe)7439-89-60.085682.550000.82357
Lead (Pb)7439-92-10.001010.030000.00969
Phosphorus (P)7723-14-00.005040.150000.04845
Tin (Sn)7440-31-50.006720.200000.06459
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68146
subTotal3.36000100.0000032.29691
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.22371
PigmentCarbon black1333-86-40.019440.300000.18686
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.27052
Phenolic resinProprietary0.583209.000005.60582
subTotal6.48000100.0000062.28691
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.22894
subTotal0.44000100.000004.22936
WireGold alloyGold (Au)7440-57-50.0319699.000000.30723
Palladium (Pd)7440-05-30.000321.000000.00310
subTotal0.03228100.000000.31033
total10.40347100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.