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Chemical content 74LVC1G06GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1G06GXSOT1226-3X2SON50.60078 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298376125712601235Seremban, Malaysia; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000003.41454
subTotal0.02051100.000003.41454
ComponentAdditiveNon hazardousProprietary0.000205.000000.03329
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03329
Silica -amorphous-7631-86-90.0020050.000000.33290
PolymerEpoxy resin systemProprietary0.0012030.000000.19974
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06658
subTotal0.00400100.000000.66580
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.79998
Magnesium (Mg)7439-95-40.000380.150000.06317
Nickel (Ni)7440-02-00.007462.950001.24230
Silicon (Si)7440-21-30.001620.640000.26952
Pure metal layerGold (Au)7440-57-50.000050.020000.00842
Nickel (Ni)7440-02-00.004151.640000.69064
Palladium (Pd)7440-05-30.000230.090000.03790
subTotal0.25300100.0000042.11193
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21292
FillerSilica -amorphous-7631-86-90.000900.290000.15060
Silica fused60676-86-00.2687986.1500044.73984
HardenerPhenolic resinProprietary0.013384.290002.22790
PigmentCarbon black1333-86-40.000590.190000.09867
PolymerEpoxy resin systemProprietary0.027058.670004.50255
subTotal0.31200100.0000051.93248
WireGold alloyGold (Au)7440-57-50.0111699.000001.85714
Palladium (Pd)7440-05-30.000111.000000.01876
subTotal0.01127100.000001.87590
total0.60078100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.