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Chemical content 74LVC1G19GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G19GSSOT1202X2SON60.96442 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292907132512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02938100.000003.04592
subTotal0.02938100.000003.04592
ComponentAdditiveNon hazardousProprietary0.000255.000000.02592
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02592
Silica -amorphous-7631-86-90.0025050.000000.25922
PolymerEpoxy resin systemProprietary0.0015030.000000.15553
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05184
subTotal0.00500100.000000.51843
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.25662
Magnesium (Mg)7439-95-40.000630.150000.06548
Nickel (Ni)7440-02-00.012422.950001.28777
Silicon (Si)7440-21-30.002690.640000.27938
Pure metal layerGold (Au)7440-57-50.000080.020000.00873
Nickel (Ni)7440-02-00.006901.640000.71591
Palladium (Pd)7440-05-30.000380.090000.03929
subTotal0.42100100.0000043.65318
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20874
FillerSilica -amorphous-7631-86-90.001420.290000.14764
Silica fused60676-86-00.4230086.1500043.86020
HardenerPhenolic resinProprietary0.021064.290002.18410
PigmentCarbon black1333-86-40.000930.190000.09673
PolymerEpoxy resin systemProprietary0.042578.670004.41402
subTotal0.49100100.0000050.91143
WireGold alloyGold (Au)7440-57-50.0178699.000001.85236
Palladium (Pd)7440-05-30.000181.000000.01871
subTotal0.01805100.000001.87107
total0.96442100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.