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Chemical content 74LVC1G19GV

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Type numberPackagePackage descriptionTotal product weight
74LVC1G19GVSOT457SC-7410.63148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352734691251712601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14109
PolymerResin systemProprietary0.0050025.000000.04703
subTotal0.02000100.000000.18812
DieDoped siliconSilicon (Si)7440-21-30.07833100.000000.73682
subTotal0.07833100.000000.73682
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.50220
Iron (Fe)7439-89-60.074182.150000.69769
Phosphorus (P)7723-14-00.000520.015200.00493
Zinc (Zn)7440-66-60.002000.058000.01882
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22716
subTotal3.45000100.0000032.45080
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.54239
PigmentCarbon black1333-86-40.019560.300000.18398
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.08148
Phenolic resinProprietary0.586809.000005.51946
subTotal6.52000100.0000061.32731
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.89065
subTotal0.52000100.000004.89114
WireGold alloyGold (Au)7440-57-50.0427199.000000.40176
Palladium (Pd)7440-05-30.000431.000000.00406
subTotal0.04314100.000000.40582
total10.63148100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.