Chemical content 74LVC1G3157GM-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
74LVC1G3157GM-Q100	SOT886	XSON6	1.96355 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935300911115	10	1	260		1	235			Nijmegen, Netherlands; Bangkok, Thailand; Hefei, China; Seremban, Malaysia; Shanghai, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.09611	100.00000	4.89483
		subTotal		0.09611	100.00000	4.89483

Component	Additive	Non hazardous	Proprietary	0.00025	5.00000	0.01273
	Filler	Bisphenol A-epichlorohydrin resin	25068-38-6	0.00025	5.00000	0.01273
		Silica -amorphous-	7631-86-9	0.00250	50.00000	0.12732
	Polymer	Epoxy resin system	Proprietary	0.00150	30.00000	0.07639
		Phenol Formaldehyde resin (generic)	9003-35-4	0.00050	10.00000	0.02546
		subTotal		0.00500	100.00000	0.25463

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.72962	94.51000	37.15807
		Magnesium (Mg)	7439-95-4	0.00116	0.15000	0.05897
		Nickel (Ni)	7440-02-0	0.02277	2.95000	1.15984
		Silicon (Si)	7440-21-3	0.00494	0.64000	0.25163
	Pure metal layer	Gold (Au)	7440-57-5	0.00015	0.02000	0.00786
		Nickel (Ni)	7440-02-0	0.01266	1.64000	0.64479
		Palladium (Pd)	7440-05-3	0.00069	0.09000	0.03538
		subTotal		0.77200	100.00000	39.31654

Mould Compound	Additive	Non hazardous	Proprietary	0.00437	0.41000	0.22259
	Filler	Silica -amorphous-	7631-86-9	0.00309	0.29000	0.15744
		Silica fused	60676-86-0	0.91836	86.15000	46.77034
	Hardener	Phenolic resin	Proprietary	0.04573	4.29000	2.32902
	Pigment	Carbon black	1333-86-4	0.00203	0.19000	0.10315
	Polymer	Epoxy resin system	Proprietary	0.09242	8.67000	4.70689
		subTotal		1.06600	100.00000	54.28943

Wire	Gold alloy	Gold (Au)	7440-57-5	0.02419	99.00000	1.23199
		Palladium (Pd)	7440-05-3	0.00024	1.00000	0.01244
		subTotal		0.02444	100.00000	1.24443

		total		1.96355	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.