Chemical content 74LVC1G3157GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G3157GW-Q100SOT363-2SC-885.60787 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300245125812601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Seremban, Malaysia; Hefei, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.13120
PolymerResin systemProprietary0.0024525.000000.04373
DieDoped siliconSilicon (Si)7440-21-30.12815100.000002.28518
Lead FrameCopper alloyCopper (Cu)7440-50-82.0113395.3237035.86620
Iron (Fe)7439-89-60.044272.098000.78939
Lead (Pb)7439-92-10.000010.000300.00011
Phosphorus (P)7723-14-00.000780.037100.01396
Zinc (Zn)7440-66-60.002550.121000.04553
Pure metal layerSilver (Ag)7440-22-40.051062.419900.91050
Mould CompoundAdditiveNon hazardousProprietary0.086132.900001.53588
FillerSilica -amorphous-7631-86-92.1384072.0000038.13213
PigmentCarbon black1333-86-40.001480.050000.02648
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4455015.000007.94419
Phenol Formaldehyde resin (generic)9003-35-40.2970010.000005.29613
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00033
Tin solderTin (Sn)7440-31-50.3699699.990006.59721
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0199099.990000.35492
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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