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Chemical content 74LVC1G66GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G66GSSOT1202X2SON60.96926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292918132612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03680100.000003.79695
subTotal0.03680100.000003.79695
ComponentAdditiveNon hazardousProprietary0.000255.000000.02579
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02579
Silica -amorphous-7631-86-90.0025050.000000.25793
PolymerEpoxy resin systemProprietary0.0015030.000000.15476
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05159
subTotal0.00500100.000000.51586
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.05061
Magnesium (Mg)7439-95-40.000630.150000.06515
Nickel (Ni)7440-02-00.012422.950001.28134
Silicon (Si)7440-21-30.002690.640000.27799
Pure metal layerGold (Au)7440-57-50.000080.020000.00869
Nickel (Ni)7440-02-00.006901.640000.71234
Palladium (Pd)7440-05-30.000380.090000.03909
subTotal0.42100100.0000043.43521
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20769
FillerSilica -amorphous-7631-86-90.001420.290000.14691
Silica fused60676-86-00.4230086.1500043.64118
HardenerPhenolic resinProprietary0.021064.290002.17319
PigmentCarbon black1333-86-40.000930.190000.09625
PolymerEpoxy resin systemProprietary0.042578.670004.39198
subTotal0.49100100.0000050.65720
WireGold alloyGold (Au)7440-57-50.0153099.000001.57857
Palladium (Pd)7440-05-30.000151.000000.01595
subTotal0.01546100.000001.59452
total0.96926100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.