Chemical content 74LVC1G66GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G66GSSOT1202X2SON60.96926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935292918132612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03680100.000003.79695
ComponentAdditiveNon hazardousProprietary0.000255.000000.02579
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02579
Silica -amorphous-7631-86-90.0025050.000000.25793
PolymerEpoxy resin systemProprietary0.0015030.000000.15476
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05159
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.05061
Magnesium (Mg)7439-95-40.000630.150000.06515
Nickel (Ni)7440-02-00.012422.950001.28134
Silicon (Si)7440-21-30.002690.640000.27799
Pure metal layerGold (Au)7440-57-50.000080.020000.00869
Nickel (Ni)7440-02-00.006901.640000.71234
Palladium (Pd)7440-05-30.000380.090000.03909
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20769
FillerSilica -amorphous-7631-86-90.001420.290000.14691
Silica fused60676-86-00.4230086.1500043.64118
HardenerPhenolic resinProprietary0.021064.290002.17319
PigmentCarbon black1333-86-40.000930.190000.09625
PolymerEpoxy resin systemProprietary0.042578.670004.39198
WireGold alloyGold (Au)7440-57-50.0153099.000001.57857
Palladium (Pd)7440-05-30.000151.000000.01595
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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