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Chemical content 74LVC1G66GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G66GW-Q100SOT353-1UMT55.69321 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299068125612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12805
PolymerResin systemProprietary0.0024325.000000.04268
subTotal0.00972100.000000.17073
DieDoped siliconSilicon (Si)7440-21-30.09814100.000001.72380
subTotal0.09814100.000001.72380
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.50918
Iron (Fe)7439-89-60.045512.310000.79932
Lead (Pb)7439-92-10.000200.010000.00346
Phosphorus (P)7723-14-00.001380.070000.02422
Zinc (Zn)7440-66-60.002360.120000.04152
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22492
subTotal1.97000100.0000034.60262
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.09034
Silica fused60676-86-02.3217570.5700040.78109
PigmentCarbon black1333-86-40.006580.200000.11558
PolymerEpoxy resin systemProprietary0.305649.290005.36852
Phenolic resinProprietary0.195435.940003.43262
subTotal3.29000100.0000057.78815
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.44454
subTotal0.31000100.000005.44507
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0153599.990000.26954
subTotal0.01535100.000000.26957
total5.69321100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.