Chemical content 74LVC1G74GT-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G74GT-Q100SOT833-1XSON82.49387 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299297115912601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Ayutthaya, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08956100.000003.59118
ComponentAdditiveNon hazardousProprietary0.000755.000000.03007
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03007
Silica -amorphous-7631-86-90.0075050.000000.30074
PolymerEpoxy resin systemProprietary0.0045030.000000.18044
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06015
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.45447
Magnesium (Mg)7439-95-40.001530.145700.06152
Nickel (Ni)7440-02-00.030682.914001.23039
Silicon (Si)7440-21-30.006650.631400.26660
Pure metal layerGold (Au)7440-57-50.000370.035000.01478
Nickel (Ni)7440-02-00.028562.712001.14510
Palladium (Pd)7440-05-30.001260.120000.05067
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21405
FillerSilica -amorphous-7631-86-90.003780.290000.15140
Silica fused60676-86-01.1216786.1500044.97720
HardenerPhenolic resinProprietary0.055864.290002.23972
PigmentCarbon black1333-86-40.002470.190000.09920
PolymerEpoxy resin systemProprietary0.112888.670004.52643
WireGold alloyGold (Au)7440-57-50.0339799.000001.36202
Palladium (Pd)7440-05-30.000341.000000.01376
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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