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Chemical content 74LVC1GU04GV

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Type numberPackagePackage descriptionTotal product weight
74LVC1GU04GVSOT753SO510.38354 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352720221251912601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07223
PolymerResin systemProprietary0.0025025.000000.02408
subTotal0.01000100.000000.09631
DieDoped siliconSilicon (Si)7440-21-30.06833100.000000.65803
subTotal0.06833100.000000.65803
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.72802
Iron (Fe)7439-89-60.085682.550000.82515
Lead (Pb)7439-92-10.001010.030000.00971
Phosphorus (P)7723-14-00.005040.150000.04854
Tin (Sn)7440-31-50.006720.200000.06472
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68277
subTotal3.36000100.0000032.35891
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.30859
PigmentCarbon black1333-86-40.019440.300000.18722
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.29407
Phenolic resinProprietary0.583209.000005.61658
subTotal6.48000100.0000062.40646
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23705
subTotal0.44000100.000004.23747
WireGold alloyGold (Au)7440-57-50.0249699.000000.24041
Palladium (Pd)7440-05-30.000251.000000.00243
subTotal0.02522100.000000.24284
total10.38354100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.