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Chemical content 74LVC1GU04GX

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Type numberPackagePackage descriptionTotal product weight
74LVC1GU04GXSOT1226-3X2SON50.60589 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298388125712601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02562100.000004.22894
subTotal0.02562100.000004.22894
ComponentAdditiveNon hazardousProprietary0.000205.000000.03301
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03301
Silica -amorphous-7631-86-90.0020050.000000.33009
PolymerEpoxy resin systemProprietary0.0012030.000000.19806
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06602
subTotal0.00400100.000000.66019
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.46431
Magnesium (Mg)7439-95-40.000380.150000.06264
Nickel (Ni)7440-02-00.007462.950001.23182
Silicon (Si)7440-21-30.001620.640000.26724
Pure metal layerGold (Au)7440-57-50.000050.020000.00835
Nickel (Ni)7440-02-00.004151.640000.68481
Palladium (Pd)7440-05-30.000230.090000.03758
subTotal0.25300100.0000041.75675
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21113
FillerSilica -amorphous-7631-86-90.000900.290000.14933
Silica fused60676-86-00.2687986.1500044.36251
HardenerPhenolic resinProprietary0.013384.290002.20911
PigmentCarbon black1333-86-40.000590.190000.09784
PolymerEpoxy resin systemProprietary0.027058.670004.46457
subTotal0.31200100.0000051.49449
WireGold alloyGold (Au)7440-57-50.0111699.000001.84147
Palladium (Pd)7440-05-30.000111.000000.01860
subTotal0.01127100.000001.86007
total0.60589100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.