×

Chemical content 74LVC2G06GX

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G06GXSOT1255-2X2SON60.75327 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307079147612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04528100.000006.01073
subTotal0.04528100.000006.01073
ComponentAdditiveNon hazardousProprietary0.000255.000000.03319
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03319
Silica -amorphous-7631-86-90.0025050.000000.33189
PolymerEpoxy resin systemProprietary0.0015030.000000.19913
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06638
subTotal0.00500100.000000.66378
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.38523
Magnesium (Mg)7439-95-40.000440.150000.05775
Nickel (Ni)7440-02-00.008562.950001.13571
Silicon (Si)7440-21-30.001860.640000.24639
Pure metal layerGold (Au)7440-57-50.000060.020000.00770
Nickel (Ni)7440-02-00.004761.640000.63138
Palladium (Pd)7440-05-30.000260.090000.03465
subTotal0.29000100.0000038.49881
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21663
FillerSilica -amorphous-7631-86-90.001150.290000.15323
Silica fused60676-86-00.3428886.1500045.51847
HardenerPhenolic resinProprietary0.017074.290002.26668
PigmentCarbon black1333-86-40.000760.190000.10039
PolymerEpoxy resin systemProprietary0.034518.670004.58091
subTotal0.39800100.0000052.83631
WireGold alloyGold (Au)7440-57-50.0148499.000001.97009
Palladium (Pd)7440-05-30.000151.000000.01990
subTotal0.01499100.000001.98999
total0.75327100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.