Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G07GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G07GMSOT886XSON61.906042 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527716913215126030 s123520 s3
93527716911515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.049629100.0000002.603773
subTotal0.049629100.0000002.603773
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.013116
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013116
Silica -amorphous-7631-86-90.00250050.0000000.131162
PolymerEpoxy resin systemProprietary0.00150030.0000000.078697
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.026232
subTotal0.005000100.0000000.262324
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.279177
Magnesium (Mg)7439-95-40.0011580.1500000.060754
Nickel (Ni)7440-02-00.0227742.9500001.194832
Silicon (Si)7440-21-30.0049410.6400000.259218
Pure metal layerGold (Au)7440-57-50.0001540.0200000.008101
Nickel (Ni)7440-02-00.0126611.6400000.664246
Palladium (Pd)7440-05-30.0006950.0900000.036453
subTotal0.772000100.00000040.502780
Mould CompoundAdditiveNon hazardousProprietary0.0043660.4100000.229087
FillerSilica -amorphous-7631-86-90.0030880.2900000.162037
Silica fused60676-86-00.91749886.15000048.136269
HardenerPhenolic resinProprietary0.0456884.2900002.397035
PigmentCarbon black1333-86-40.0020240.1900000.106162
PolymerEpoxy resin systemProprietary0.0923368.6700004.844358
subTotal1.065000100.00000055.874949
WireImpurityNon hazardousProprietary0.0000010.0100000.000076
Pure metalCopper (Cu)7440-50-80.01390796.4900000.729640
Pure metal layerGold (Au)7440-57-50.0000720.5000000.003781
Palladium (Pd)7440-05-30.0004323.0000000.022685
subTotal0.014413100.0000000.756182
total1.906042100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.