Chemical content 74LVC2G3157DP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G3157DPSOT552-1TSSOP1023.43376 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935307104118612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.7209080.100003.07633
PolymerResin systemProprietary0.1791019.900000.76428
DieDoped siliconSilicon (Si)7440-21-30.21827100.000000.93143
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.8950797.4700033.69101
Iron (Fe)7439-89-60.194402.400000.82957
Phosphorus (P)7723-14-00.002430.030000.01037
Zinc (Zn)7440-66-60.008100.100000.03457
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-711.5050088.5000049.09583
Flame retardantNon hazardousProprietary0.390003.000001.66427
PolymerEpoxy resin systemProprietary1.105008.500004.71542
Pre-PlatingPure metal layerGold (Au)7440-57-50.011001.000000.04694
Nickel (Ni)7440-02-01.0670097.000004.55326
Palladium (Pd)7440-05-30.022002.000000.09388
WirePure metalGold (Au)7440-57-50.1143399.000000.48790
Palladium (Pd)7440-05-30.001151.000000.00493
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.