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Chemical content 74LVC2G53GS

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Type numberPackagePackage descriptionTotal product weight
74LVC2G53GSSOT1203X2SON81.34079 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292379115612601235Bangkok, Thailand; Seremban, Malaysia; Ayutthaya, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05079100.000003.78782
subTotal0.05079100.000003.78782
ComponentAdditiveNon hazardousProprietary0.000305.000000.02237
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02237
Silica -amorphous-7631-86-90.0030050.000000.22375
PolymerEpoxy resin systemProprietary0.0018030.000000.13425
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04475
subTotal0.00600100.000000.44749
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.60126
Magnesium (Mg)7439-95-40.000860.150000.06444
Nickel (Ni)7440-02-00.016992.950001.26731
Silicon (Si)7440-21-30.003690.640000.27494
Pure metal layerGold (Au)7440-57-50.000120.020000.00859
Nickel (Ni)7440-02-00.009451.640000.70454
Palladium (Pd)7440-05-30.000520.090000.03866
subTotal0.57600100.0000042.95974
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20885
FillerSilica -amorphous-7631-86-90.001980.290000.14773
Silica fused60676-86-00.5884086.1500043.88491
HardenerPhenolic resinProprietary0.029304.290002.18533
PigmentCarbon black1333-86-40.001300.190000.09679
PolymerEpoxy resin systemProprietary0.059228.670004.41651
subTotal0.68300100.0000050.94012
WireGold alloyGold (Au)7440-57-50.0247599.000001.84630
Palladium (Pd)7440-05-30.000251.000000.01865
subTotal0.02501100.000001.86495
total1.34079100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.