Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G74GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G74GNSOT1116X2SON81.172490 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352922481156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.044780100.0000003.819196
subTotal0.044780100.0000003.819196
ComponentAdditiveNon hazardousProprietary0.0007005.0000000.059702
FillerBisphenol A-epichlorohydrin resin25068-38-60.0007005.0000000.059702
Silica -amorphous-7631-86-90.00700050.0000000.597020
PolymerEpoxy resin systemProprietary0.00420030.0000000.358212
Phenol Formaldehyde resin (generic)9003-35-40.00140010.0000000.119404
subTotal0.014000100.0000001.194040
Lead FrameCopper alloyCopper (Cu)7440-50-80.47287892.90330040.331073
Magnesium (Mg)7439-95-40.0007380.1449000.062904
Nickel (Ni)7440-02-00.0147472.8972001.257729
Silicon (Si)7440-21-30.0031950.6277000.272496
MetallisationGold (Au)7440-57-50.0002140.0421000.018276
Nickel (Ni)7440-02-00.0165013.2418001.407326
Palladium (Pd)7440-05-30.0007280.1430000.062079
subTotal0.509000100.00000043.411884
Mould CompoundAdditiveNon hazardousProprietary0.0023820.4100000.203166
FillerSilica -amorphous-7631-86-90.0016850.2900000.143703
Silica fused60676-86-00.50053286.15000042.689618
HardenerPhenolic resinProprietary0.0249254.2900002.125809
PigmentCarbon black1333-86-40.0011040.1900000.094150
PolymerEpoxy resin systemProprietary0.0503738.6700004.296216
subTotal0.581000100.00000049.552661
WireGold alloyGold (Au)7440-57-50.02347399.0000002.001970
Palladium (Pd)7440-05-30.0002371.0000000.020222
subTotal0.023710100.0000002.022192
total1.172490100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.