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Chemical content 74LVC3G04GN

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Type numberPackagePackage descriptionTotal product weight
74LVC3G04GNSOT1116X2SON81.17492 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292252115612601235Ayutthaya, Thailand; Seremban, Malaysia; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04716100.000004.01395
subTotal0.04716100.000004.01395
ComponentAdditiveNon hazardousProprietary0.000705.000000.05958
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05958
Silica -amorphous-7631-86-90.0070050.000000.59579
PolymerEpoxy resin systemProprietary0.0042030.000000.35747
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11916
subTotal0.01400100.000001.19158
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033040.24766
Magnesium (Mg)7439-95-40.000740.144900.06277
Nickel (Ni)7440-02-00.014752.897201.25513
Silicon (Si)7440-21-30.003190.627700.27193
MetallisationGold (Au)7440-57-50.000210.042100.01824
Nickel (Ni)7440-02-00.016503.241801.40442
Palladium (Pd)7440-05-30.000730.143000.06195
subTotal0.50900100.0000043.32210
Mould CompoundAdditiveNon hazardousProprietary0.002380.410000.20275
FillerSilica -amorphous-7631-86-90.001680.290000.14341
Silica fused60676-86-00.5005386.1500042.60133
HardenerPhenolic resinProprietary0.024924.290002.12141
PigmentCarbon black1333-86-40.001100.190000.09396
PolymerEpoxy resin systemProprietary0.050378.670004.28733
subTotal0.58100100.0000049.45019
WireGold alloyGold (Au)7440-57-50.0235299.000002.00162
Palladium (Pd)7440-05-30.000241.000000.02022
subTotal0.02376100.000002.02184
total1.17492100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.