×

Chemical content 74LVC3G07GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC3G07GTSOT833-1XSON82.50009 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352789331151812601235Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09432100.000003.77272
subTotal0.09432100.000003.77272
ComponentAdditiveNon hazardousProprietary0.000755.000000.03000
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03000
Silica -amorphous-7631-86-90.0075050.000000.29999
PolymerEpoxy resin systemProprietary0.0045030.000000.17999
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06000
subTotal0.01500100.000000.59998
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.35631
Magnesium (Mg)7439-95-40.001530.145700.06137
Nickel (Ni)7440-02-00.030682.914001.22733
Silicon (Si)7440-21-30.006650.631400.26594
Pure metal layerGold (Au)7440-57-50.000370.035000.01474
Nickel (Ni)7440-02-00.028562.712001.14225
Palladium (Pd)7440-05-30.001260.120000.05054
subTotal1.05300100.0000042.11848
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21352
FillerSilica -amorphous-7631-86-90.003780.290000.15103
Silica fused60676-86-01.1216786.1500044.86530
HardenerPhenolic resinProprietary0.055864.290002.23415
PigmentCarbon black1333-86-40.002470.190000.09895
PolymerEpoxy resin systemProprietary0.112888.670004.51517
subTotal1.30200100.0000052.07812
WireGold alloyGold (Au)7440-57-50.0354199.000001.41644
Palladium (Pd)7440-05-30.000361.000000.01431
subTotal0.03577100.000001.43075
total2.50009100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.