Chemical content 74LVC4066D

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Type numberPackagePackage descriptionTotal product weight
74LVC4066DSOT108-1SO14123.26478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352737171181212601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06320
PolymerAcrylic resinProprietary0.0152015.200000.01233
Resin systemProprietary0.006906.900000.00560
DieDoped siliconSilicon (Si)7440-21-30.27988100.000000.22706
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.21942
Iron (Fe)7439-89-61.068962.400000.86721
Phosphorus (P)7723-14-00.013360.030000.01084
Zinc (Zn)7440-66-60.044540.100000.03613
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95845
FillerSilica fused60676-86-061.2961079.0000049.72718
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77675
PigmentCarbon black1333-86-40.155180.200000.12589
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51783
Non hazardousProprietary3.181194.100002.58078
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25892
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52724
Palladium (Pd)7440-05-30.013402.000000.01087
WirePure metalCopper (Cu)7440-50-80.08490100.000000.06888
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.