Chemical content 74LVC74ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC74ABQ-Q100SOT762-1DHVQFN1418.16296 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301368115412601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09605
PolymerAcrylic resinProprietary0.001406.000000.00768
Resin systemProprietary0.0041918.000000.02305
DieDoped siliconSilicon (Si)7440-21-30.18577100.000001.02280
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.13442
Iron (Fe)7439-89-60.166072.400000.91436
Phosphorus (P)7723-14-00.002080.030000.01143
Zinc (Zn)7440-66-60.006920.100000.03810
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68548
FillerSilica -amorphous-7631-86-90.367153.490002.02141
Silica fused60676-86-08.9230784.8200049.12785
PigmentCarbon black1333-86-40.016830.160000.09267
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62554
Epoxy resin systemProprietary0.167271.590000.92093
Phenolic resinProprietary0.236702.250001.30320
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14304
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07621
Nickel (Ni)7440-02-00.4258792.300002.34473
Palladium (Pd)7440-05-30.014303.100000.07875
Silver (Ag)7440-22-40.007381.600000.04065
WirePure metalCopper (Cu)7440-50-80.0509296.550000.28036
Pure metal layerGold (Au)7440-57-50.000180.350000.00102
Palladium (Pd)7440-05-30.001633.100000.00900
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.