Chemical content 74LVCH16373ADGG-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH16373ADGG-Q100SOT362-1TSSOP48194.10794 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935304872118412601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.092001.000000.04740
FillerSilver (Ag)7440-22-46.9000075.000003.55472
PolymerAcrylic resinProprietary0.552006.000000.28438
Resin systemProprietary1.6560018.000000.85313
DieDoped siliconSilicon (Si)7440-21-30.85171100.000000.43878
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.6500097.0000022.48749
Nickel (Ni)7440-02-01.350003.000000.69549
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-7119.4750088.5000061.55081
Flame retardantNon hazardousProprietary4.050003.000002.08647
PolymerEpoxy resin systemProprietary11.475008.500005.91166
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.01649
Nickel (Ni)7440-02-03.1040097.000001.59911
Palladium (Pd)7440-05-30.064002.000000.03297
WirePure metalGold (Au)7440-57-50.8476799.000000.43670
Palladium (Pd)7440-05-30.008561.000000.00441
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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