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Chemical content 74LVCH1T45GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH1T45GW-Q100SOT363-2SC-885.76243 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300936125712601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12768
PolymerResin systemProprietary0.0024525.000000.04256
subTotal0.00981100.000000.17024
DieDoped siliconSilicon (Si)7440-21-30.11277100.000001.95702
subTotal0.11277100.000001.95702
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.45942
Iron (Fe)7439-89-60.048742.310000.84584
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02563
Zinc (Zn)7440-66-60.002530.120000.04394
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23801
subTotal2.11000100.0000036.61650
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.62873
Silica fused60676-86-02.2159070.5700038.45423
PigmentCarbon black1333-86-40.006280.200000.10898
PolymerEpoxy resin systemProprietary0.291719.290005.06220
Phenolic resinProprietary0.186525.940003.23676
subTotal3.14000100.0000054.49090
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.42026
subTotal0.37000100.000006.42089
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0198499.990000.34438
subTotal0.01985100.000000.34441
total5.76243100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.