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Chemical content 74LVT245BQ

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Type numberPackagePackage descriptionTotal product weight
74LVT245BQSOT764-1DHVQFN2028.37002 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352856041151212601235Suzhou, China; Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0240060.000000.08460
ImpurityNon hazardousProprietary0.000020.039500.00006
PolymerResin systemProprietary0.0159839.951410.05633
subTotal0.04000100.000000.14099
DieDoped siliconSilicon (Si)7440-21-30.72435100.000002.55322
subTotal0.72435100.000002.55322
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.32518
Iron (Fe)7439-89-60.260742.400000.91906
Phosphorus (P)7723-14-00.003260.030000.01149
Zinc (Zn)7440-66-60.010860.100000.03829
subTotal10.86402100.0000038.29402
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67962
FillerSilica -amorphous-7631-86-90.571483.490002.01440
Silica fused60676-86-013.8892084.8200048.95731
PigmentCarbon black1333-86-40.026200.160000.09235
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62337
Epoxy resin systemProprietary0.260361.590000.91773
Phenolic resinProprietary0.368442.250001.29868
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13561
subTotal16.37491100.0000057.71907
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00972
Nickel (Ni)7440-02-00.2509591.000000.88456
Palladium (Pd)7440-05-30.022068.000000.07776
subTotal0.27577100.000000.97204
WirePure metalCopper (Cu)7440-50-80.0878396.550000.30959
Pure metal layerGold (Au)7440-57-50.000320.350000.00112
Palladium (Pd)7440-05-30.002823.100000.00994
subTotal0.09097100.000000.32065
total28.37002100.00000100.00000
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