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Chemical content BAS321J

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Type numberPackagePackage descriptionTotal product weight
BAS321JSOD323FSOD323F3.77276 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660321115312601235Melaka, Malaysia; Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
934660321135212601235Melaka, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000001.06023
subTotal0.04000100.000001.06023
Lead FrameCopper alloyCopper (Cu)7440-50-81.4745297.6500039.08319
Iron (Fe)7439-89-60.031862.110000.84450
Phosphorus (P)7723-14-00.000450.030000.01201
Zinc (Zn)7440-66-60.001960.130000.05203
Pure metal layerSilver (Ag)7440-22-40.001210.080000.03202
subTotal1.51000100.0000040.02375
Mould CompoundFillerSilica fused60676-86-01.6071475.1000042.59852
PigmentCarbon black1333-86-40.006420.300000.17017
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3745017.500009.92642
Phenol Formaldehyde resin (generic)9003-35-40.151947.100004.02729
subTotal2.14000100.0000056.72240
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000040.055500.00118
Tin solderTin (Sn)7440-31-50.0799599.940002.11919
subTotal0.08000100.000002.12047
WirePure metalCopper (Cu)7440-50-80.00276100.000000.07306
subTotal0.00276100.000000.07306
total3.77276100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.