×

Chemical content BAT854SW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT854SWSOT323SC-705.51682 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340561751151312601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
934056175135112601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
934056175300112601235Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000001.81264
subTotal0.10000100.000001.81264
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02936
Carbon (C)7440-44-00.000720.040000.01305
Chromium (Cr)7440-47-30.003780.210000.06852
Cobalt (Co)7440-48-40.007560.420000.13704
Iron (Fe)7439-89-60.8490647.1700015.39039
Manganese (Mn)7439-96-50.015300.850000.27733
Nickel (Ni)7440-02-00.6397235.5400011.59581
Phosphorus (P)7723-14-00.000360.020000.00653
Silicon (Si)7440-21-30.004500.250000.08157
Sulphur (S)7704-34-90.000360.020000.00653
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.25789
Silver (Ag)7440-22-40.042122.340000.76348
subTotal1.80000100.0000032.62750
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.28391
PigmentCarbon black1333-86-40.010200.300000.18489
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.78520
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.37571
subTotal3.40000100.0000061.62971
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.80616
subTotal0.21000100.000003.80654
WirePure metalCopper (Cu)7440-50-80.00682100.000000.12356
subTotal0.00682100.000000.12356
total5.51682100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.