×

Chemical content BAV99

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAV99SOT23TO-236AB7.67933 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9332153702351612601235Seremban, Malaysia; Suqian, China; Melaka, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9332153702151512601235Dongguan, China; Seremban, Malaysia; Suqian, China; D-22529 HAMBURG, Germany; Melaka, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000000.78132
subTotal0.06000100.000000.78132
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02987
Carbon (C)7440-44-00.001020.040000.01328
Chromium (Cr)7440-47-30.005610.220000.07302
Cobalt (Co)7440-48-40.010960.430000.14273
Iron (Fe)7439-89-61.2230147.9800015.92600
Manganese (Mn)7439-96-50.021920.860000.28546
Nickel (Ni)7440-02-00.9212136.1400011.99595
Phosphorus (P)7723-14-00.000510.020000.00664
Silicon (Si)7440-21-30.006630.260000.08630
Sulphur (S)7704-34-90.000510.020000.00664
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.77404
Silver (Ag)7440-22-40.065512.570000.85306
subTotal2.54900100.0000033.19299
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.84249
Triphenylphosphine603-35-00.002440.050000.03177
FillerSilica -amorphous-7631-86-93.5128872.0000045.74462
PigmentCarbon black1333-86-40.002440.050000.03177
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.53013
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.35342
subTotal4.87900100.0000063.53420
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00134
Tin solderTin (Sn)7440-31-50.1848999.940002.40762
subTotal0.18500100.000002.40907
WirePure metalCopper (Cu)7440-50-80.00633100.000000.08246
subTotal0.00633100.000000.08246
total7.67933100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.