Chemical content BC807-40QC

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Type numberPackagePackage descriptionTotal product weight
BC807-40QCSOT8009DFN1412D-32.46185 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660895147412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43220
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.05954
Phenolic resinProprietary0.0018913.530000.07694
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.24959
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.25538
Magnesium (Mg)7439-95-40.001700.145400.06898
Nickel (Ni)7440-02-00.033982.908901.38010
Silicon (Si)7440-21-30.007360.630300.29904
Pure metal layerGold (Au)7440-57-50.000440.037300.01770
Nickel (Ni)7440-02-00.033552.872201.36269
Palladium (Pd)7440-05-30.001480.126700.06011
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.60451
Silica fused60676-86-00.8906280.0920036.17698
PigmentCarbon black1333-86-40.010320.928000.41917
PolymerEpoxy resin systemProprietary0.093968.450003.81680
Phenolic resinProprietary0.028362.550001.15182
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00187
Tin solderTin (Sn)7440-31-50.0829599.940003.36943
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0048599.990000.19686
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.