Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC817-40QBH-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC817-40QBH-QSOT8015DFN1110D-31.624773 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664315147212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00456076.0000000.280655
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00062810.4700000.038664
Phenolic resinProprietary0.00081213.5300000.049964
subTotal0.006000100.0000000.369282
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000003.692824
subTotal0.060000100.0000003.692824
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.240440
Magnesium (Mg)7439-95-40.0011200.1490000.068962
Nickel (Ni)7440-02-00.0224162.9809001.379662
Silicon (Si)7440-21-30.0048570.6459000.298944
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003564
Nickel (Ni)7440-02-00.0044670.5940000.274923
Palladium (Pd)7440-05-30.0002740.0365000.016893
subTotal0.752000100.00000046.283389
Mould CompoundAdditiveNon hazardousProprietary0.0030540.4100000.187995
FillerSilica -amorphous-7631-86-90.0021600.2900000.132972
Silica fused60676-86-00.64181886.15000039.501980
HardenerPhenolic resinProprietary0.0319604.2900001.967075
PigmentCarbon black1333-86-40.0014160.1900000.087120
PolymerEpoxy resin systemProprietary0.0645928.6700003.975417
subTotal0.745000100.00000045.852559
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000158
Non hazardousProprietary0.0000320.0555000.001947
Tin solderTin (Sn)7440-31-50.05696699.9400003.506077
subTotal0.057000100.0000003.508182
WireImpurityNon hazardousProprietary0.0000000.0100000.000029
Pure metalCopper (Cu)7440-50-80.00477399.9900000.293735
subTotal0.004773100.0000000.293764
total1.624773100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.