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Chemical content BC847AMB

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Type numberPackagePackage descriptionTotal product weight
BC847AMBSOT883BXQFN30.67995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065885315612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33532
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04619
Phenolic resinProprietary0.0004113.530000.05970
subTotal0.00300100.000000.44121
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41209
subTotal0.03000100.000004.41209
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09883
Copper (Cu)7440-50-80.2632094.0000038.70873
Tin (Sn)7440-31-50.000670.240000.09883
Zinc (Zn)7440-66-60.000590.210000.08648
Pure metal layerGold (Au)7440-57-50.000220.080000.03294
Nickel (Ni)7440-02-00.013834.940002.03427
Palladium (Pd)7440-05-30.000810.290000.11942
subTotal0.28000100.0000041.17950
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.50085
Silica fused60676-86-00.2040060.0000030.00221
Flame retardantMetal hydroxideProprietary0.010203.000001.50011
ImpurityBismuth (Bi)7440-69-90.001700.500000.25002
PigmentCarbon black1333-86-40.001700.500000.25002
PolymerEpoxy resin systemProprietary0.023807.000003.50026
Phenolic resinProprietary0.020406.000003.00022
subTotal0.34000100.0000050.00369
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93963
subTotal0.02000100.000002.94139
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0069599.990001.02262
subTotal0.00695100.000001.02272
total0.67995100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.