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Chemical content BCP56H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BCP56HSOT223SC-73105.56438 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340702891155126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.13000100.000000.12315
subTotal0.13000100.000000.12315
Lead FrameCopper alloyCopper (Cu)7440-50-850.8888599.4700048.20646
Iron (Fe)7439-89-60.051160.100000.04846
Phosphorus (P)7723-14-00.015350.030000.01454
Pure metal layerSilver (Ag)7440-22-40.204640.400000.19385
subTotal51.16000100.0000048.46331
Mould CompoundFillerSilica fused60676-86-039.9682275.1000037.86146
PigmentCarbon black1333-86-40.159660.300000.15124
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.3135017.500008.82258
Phenol Formaldehyde resin (generic)9003-35-43.778627.100003.57945
subTotal53.22000100.0000050.41473
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00054
Tin solderTin (Sn)7440-31-51.0193999.940000.96566
subTotal1.02000100.000000.96624
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalCopper (Cu)7440-50-80.0343899.990000.03256
subTotal0.03438100.000000.03256
total105.56438100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.