×

Chemical content BF840

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BF840SOT23TO-236AB7.64979 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337926702351412601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
9337926702151212601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.65361
subTotal0.05000100.000000.65361
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02999
Carbon (C)7440-44-00.001020.040000.01333
Chromium (Cr)7440-47-30.005610.220000.07331
Cobalt (Co)7440-48-40.010960.430000.14328
Iron (Fe)7439-89-61.2230147.9800015.98750
Manganese (Mn)7439-96-50.021920.860000.28656
Nickel (Ni)7440-02-00.9212136.1400012.04227
Phosphorus (P)7723-14-00.000510.020000.00666
Silicon (Si)7440-21-30.006630.260000.08664
Sulphur (S)7704-34-90.000510.020000.00666
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.78862
Silver (Ag)7440-22-40.065512.570000.85635
subTotal2.54900100.0000033.32117
Mould CompoundFillerSilica fused60676-86-03.4449271.0000045.03287
PigmentCarbon black1333-86-40.014560.300000.19028
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9558419.7000012.49504
Phenolic resinProprietary0.436689.000005.70839
subTotal4.85200100.0000063.42658
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00134
Tin solderTin (Sn)7440-31-50.1848999.940002.41692
subTotal0.18500100.000002.41837
WirePure metalGold (Au)7440-57-50.01379100.000000.18027
subTotal0.01379100.000000.18027
total7.64979100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.