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Chemical content BUK4D122-20P

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Type numberPackagePackage descriptionTotal product weight
BUK4D122-20PSOT1220SOT12207.02436 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661264115712601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00997
FillerSilver (Ag)7440-22-40.0588084.000000.83709
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09965
Isobornyl Methacrylate7534-94-30.003505.000000.04983
subTotal0.07000100.000000.99654
DieDoped siliconSilicon (Si)7440-21-30.15000100.000002.13543
subTotal0.15000100.000002.13543
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956038.50761
Magnesium (Mg)7439-95-40.004220.145900.06003
Nickel (Ni)7440-02-00.084352.918801.20087
Silicon (Si)7440-21-30.018280.632400.26019
Pure metal layerGold (Au)7440-57-50.000960.033300.01370
Nickel (Ni)7440-02-00.074012.561001.05366
Palladium (Pd)7440-05-30.003270.113000.04649
subTotal2.89000100.0000041.14255
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000012.21321
Silica fused60676-86-02.2380060.0000031.86055
Flame retardantMetal hydroxideProprietary0.111903.000001.59303
ImpurityBismuth (Bi)7440-69-90.018650.500000.26550
PigmentCarbon black1333-86-40.018650.500000.26550
PolymerEpoxy resin systemProprietary0.261107.000003.71706
Phenolic resinProprietary0.223806.000003.18606
subTotal3.73000100.0000053.10091
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00134
Tin solderTin (Sn)7440-31-50.1699099.940002.41870
subTotal0.17000100.000002.42015
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0143699.990000.20446
subTotal0.01436100.000000.20448
total7.02436100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.