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Chemical content BUK9620-100B

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Type numberPackagePackage descriptionTotal product weight
BUK9620-100BSOT404D2PAK1438.89498 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934062452118612451245Manchester, United Kingdom; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-37.10000100.000000.49343
subTotal7.10000100.000000.49343
Lead FrameCopper alloyCopper (Cu)7440-50-8823.4241699.0800057.22615
Iron (Fe)7439-89-61.246600.150000.08664
Nickel (Ni)7440-02-06.066810.730000.42163
Phosphorus (P)7723-14-00.332430.040000.02310
subTotal831.07000100.0000057.75752
Mould CompoundAdditiveBromine atom (Br)10097-32-25.705201.000000.39650
FillerMisc. Silica compounds (generic)14808-60-7439.3004077.0000030.53040
Flame retardantAntimony Trioxide (Sb2O3)1309-64-411.410402.000000.79300
PolymerEpoxy resin systemProprietary114.1040020.000007.92997
subTotal570.52000100.0000039.64987
Post-PlatingImpurityNon hazardousProprietary0.001980.010000.00014
Tin alloyTin (Sn)7440-31-519.7880299.990001.37522
subTotal19.79000100.000001.37536
Solder WireLead alloyLead (Pb)7439-92-15.7590193.500000.40024
Silver (Ag)7440-22-40.092391.500000.00642
Tin (Sn)7440-31-50.307975.000000.02140
subTotal6.15937100.000000.42806
WireImpurityNon hazardousProprietary0.000400.010000.00003
Pure metalAluminium (Al)7429-90-54.0000799.990000.27800
subTotal4.00047100.000000.27803
WireImpurityNon hazardousProprietary0.000030.010000.00000
Pure metalAluminium (Al)7429-90-50.2551199.990000.01773
subTotal0.25513100.000000.01773
total1438.89498100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.