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Chemical content BZV55-B5V1

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Type numberPackagePackage descriptionTotal product weight
BZV55-B5V1SOD80CLLDS0.65000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9338276801351312601235Shanwei, ChinaLeaded
9338276801151312601235Shanwei, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieActive agentAntimony (Sb)7440-36-00.000040.080000.00615
Doped siliconSilicon (Si)7440-21-30.0335066.990005.15308
Pure metal layerNickel (Ni)7440-02-00.000210.420000.03231
Silver (Ag)7440-22-40.0161932.380002.49077
Titanium (Ti)7440-32-60.000060.130000.01000
subTotal0.05000100.000007.69231
Post-PlatingImpurityAntimony (Sb)7440-36-00.000040.006000.00554
Bismuth (Bi)7440-69-90.000030.005000.00462
Lead (Pb)7439-92-10.000020.004000.00369
Pure metal layerTin (Sn)7440-31-50.5999199.9850092.29385
subTotal0.60000100.0000092.30770
total0.65000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.