Chemical content BZX384-A30

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Type numberPackagePackage descriptionTotal product weight
BZX384-A30SOD323SOD24.15216 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663132115312601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05400100.000001.30053
Lead FrameCopper alloyCopper (Cu)7440-50-81.2165195.0400029.29829
Iron (Fe)7439-89-60.032642.550000.78610
Lead (Pb)7439-92-10.000380.030000.00925
Phosphorus (P)7723-14-00.001920.150000.04624
Zinc (Zn)7440-66-60.002560.200000.06165
Pure metal layerSilver (Ag)7440-22-40.025982.030000.62579
Mould CompoundFillerSilica fused60676-86-02.0137375.1000048.49848
PigmentCarbon black1333-86-40.008040.300000.19374
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4692517.5000011.30124
Phenol Formaldehyde resin (generic)9003-35-40.190387.100004.58508
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00014
Non hazardousProprietary0.000070.055500.00178
Tin solderTin (Sn)7440-31-50.1332599.940003.20927
WirePure metalCopper (Cu)7440-50-80.00343100.000000.08254
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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