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Chemical content BZX58550-C2V4-Q

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Type numberPackagePackage descriptionTotal product weight
BZX58550-C2V4-QSOD523SC-791.46164 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663430115212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02800100.000001.91566
subTotal0.02800100.000001.91566
Lead FrameCopper alloyCopper (Cu)7440-50-80.5177197.6817335.42002
Iron (Fe)7439-89-60.011402.150000.77960
Phosphorus (P)7723-14-00.000180.034000.01233
Zinc (Zn)7440-66-60.000570.108000.03916
ImpurityLead (Pb)7439-92-10.000010.001270.00046
Pure metal layerCopper (Cu)7440-50-80.000030.005000.00181
Silver (Ag)7440-22-40.000110.020000.00725
subTotal0.53000100.0000036.26063
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.74650
PigmentCarbon black1333-86-40.002640.300000.18062
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.86065
Phenolic resinProprietary0.079209.000005.41857
subTotal0.88000100.0000060.20634
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00076
Tin solderTin (Sn)7440-31-50.0199999.940001.36750
subTotal0.02000100.000001.36832
WirePure metalGold (Au)7440-57-50.00364100.000000.24904
subTotal0.00364100.000000.24904
total1.46164100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.