Chemical content BZX84W-B22-Q

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Type numberPackagePackage descriptionTotal product weight
BZX84W-B22-QSOT323SC-705.47679 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664605135212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
934664605115212601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.91294
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03030
Carbon (C)7440-44-00.000740.040000.01347
Chromium (Cr)7440-47-30.001660.090000.03030
Cobalt (Co)7440-48-40.007930.430000.14478
Iron (Fe)7439-89-60.8196644.4500014.96603
Manganese (Mn)7439-96-50.012720.690000.23232
Nickel (Ni)7440-02-00.6341534.3900011.57889
Phosphorus (P)7723-14-00.000370.020000.00673
Silicon (Si)7440-21-30.004790.260000.08754
Sulphur (S)7704-34-90.000370.020000.00673
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.84837
Silver (Ag)7440-22-40.039652.150000.72389
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.78444
FillerSilica -amorphous-7631-86-92.4264072.0000044.30332
PigmentCarbon black1333-86-40.001680.050000.03077
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000009.22986
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000006.15324
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.83398
WirePure metalCopper (Cu)7440-50-80.00279100.000000.05101
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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