Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884-B12

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884-B12SOD882DFN1006-20.944320 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405720631516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.804812
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.110873
Phenolic resinProprietary0.00135313.5300000.143278
subTotal0.010000100.0000001.058963
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.294815
subTotal0.050000100.0000005.294815
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.025182
Magnesium (Mg)7439-95-40.0008200.2000000.086835
Nickel (Ni)7440-02-00.0129153.1500001.367651
Silicon (Si)7440-21-30.0028290.6900000.299581
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013025
Nickel (Ni)7440-02-00.0052071.2700000.551402
Palladium (Pd)7440-05-30.0006970.1700000.073810
subTotal0.410000100.00000043.417486
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000010.960268
Silica fused60676-86-00.27000060.00000028.592003
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.429600
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.238267
PigmentCarbon black1333-86-40.0022500.5000000.238267
PolymerEpoxy resin systemProprietary0.0315007.0000003.335734
Phenolic resinProprietary0.0270006.0000002.859200
subTotal0.450000100.00000047.653338
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000095
Non hazardousProprietary0.0000110.0555000.001175
Tin solderTin (Sn)7440-31-50.01998899.9400002.116655
subTotal0.020000100.0000002.117926
WireImpurityNon hazardousProprietary0.0000000.0100000.000046
Pure metalGold (Au)7440-57-50.00432099.9900000.457426
subTotal0.004320100.0000000.457472
total0.944320100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.