Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884-C36

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884-C36SOD882DFN1006-20.94432 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340574633151612601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80481
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11087
Phenolic resinProprietary0.0013513.530000.14328
subTotal0.01000100.000001.05896
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.29482
subTotal0.05000100.000005.29482
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.02518
Magnesium (Mg)7439-95-40.000820.200000.08683
Nickel (Ni)7440-02-00.012923.150001.36765
Silicon (Si)7440-21-30.002830.690000.29958
Pure metal layerGold (Au)7440-57-50.000120.030000.01303
Nickel (Ni)7440-02-00.005211.270000.55140
Palladium (Pd)7440-05-30.000700.170000.07381
subTotal0.41000100.0000043.41748
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.96027
Silica fused60676-86-00.2700060.0000028.59200
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.42960
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.23827
PigmentCarbon black1333-86-40.002250.500000.23827
PolymerEpoxy resin systemProprietary0.031507.000003.33573
Phenolic resinProprietary0.027006.000002.85920
subTotal0.45000100.0000047.65334
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.11666
subTotal0.02000100.000002.11794
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0043299.990000.45743
subTotal0.00432100.000000.45748
total0.94432100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.