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Chemical content LSF0108BQ

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Type numberPackagePackage descriptionTotal product weight
LSF0108BQSOT764-1DHVQFN2028.05567 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690288115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24348
PolymerResin systemProprietary0.0169719.900000.06049
subTotal0.08528100.000000.30397
DieDoped siliconSilicon (Si)7440-21-30.36948100.000001.31696
subTotal0.36948100.000001.31696
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.74339
Iron (Fe)7439-89-60.260742.400000.92935
Phosphorus (P)7723-14-00.003260.030000.01162
Zinc (Zn)7440-66-60.010860.100000.03872
subTotal10.86402100.0000038.72308
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69844
FillerSilica -amorphous-7631-86-90.571483.490002.03697
Silica fused60676-86-013.8892084.8200049.50585
PigmentCarbon black1333-86-40.026200.160000.09339
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63035
Epoxy resin systemProprietary0.260361.590000.92802
Phenolic resinProprietary0.368442.250001.31323
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15953
subTotal16.37491100.0000058.36578
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00983
Nickel (Ni)7440-02-00.2509591.000000.89447
Palladium (Pd)7440-05-30.022068.000000.07864
subTotal0.27577100.000000.98294
WirePure metalCopper (Cu)7440-50-80.0832396.550000.29667
Pure metal layerGold (Au)7440-57-50.000300.350000.00108
Palladium (Pd)7440-05-30.002673.100000.00953
subTotal0.08621100.000000.30728
total28.05567100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.