Chemical content MJD32C

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Type numberPackagePackage descriptionTotal product weight
MJD32CSOT428CDPAK316.35313 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660545118412601235D-22529 HAMBURG, Germany; Nantong, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.56000100.000000.17702
Lead FrameCopper alloyCopper (Cu)7440-50-8173.9541599.8646054.98733
Tin (Sn)7440-31-50.231670.133000.07323
Pure metal layerNickel (Ni)7440-02-00.004180.002400.00132
Mould CompoundFillerSilica fused60676-86-0121.4167588.9500038.38013
PigmentCarbon black1333-86-40.750750.550000.23731
PolymerEpoxy resin systemProprietary10.237507.500003.23610
Phenolic resinProprietary4.095003.000001.29444
Post-PlatingImpurityNon hazardousProprietary0.000030.000900.00001
Tin solderTin (Sn)7440-31-53.2599799.999101.03048
Solder WireLead alloyLead (Pb)7439-92-11.7285595.500000.54640
Silver (Ag)7440-22-40.045252.500000.01430
Tin (Sn)7440-31-50.036202.000000.01144
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalAluminium (Al)7429-90-50.0331399.990000.01047
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.