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Chemical content NBM5100ABQ

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Type numberPackagePackage descriptionTotal product weight
NBM5100ABQSOT763-1DHVQFN1621.83198 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691193115412601235Suzhou, China; Kuching, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36572
PolymerResin systemProprietary0.0198419.900000.09086
subTotal0.09968100.000000.45658
DieDoped siliconSilicon (Si)7440-21-30.75553100.000003.46064
subTotal0.75553100.000003.46064
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.84309
Iron (Fe)7439-89-60.198062.400000.90719
Phosphorus (P)7723-14-00.002480.030000.01134
Zinc (Zn)7440-66-60.008250.100000.03780
subTotal8.25236100.0000037.79942
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65793
FillerSilica -amorphous-7631-86-90.434103.490001.98838
Silica fused60676-86-010.5503084.8200048.32499
PigmentCarbon black1333-86-40.019900.160000.09116
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61531
Epoxy resin systemProprietary0.197771.590000.90588
Phenolic resinProprietary0.279872.250001.28191
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10802
subTotal12.43846100.0000056.97358
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00960
Nickel (Ni)7440-02-00.1906391.000000.87315
Palladium (Pd)7440-05-30.016768.000000.07676
subTotal0.20948100.000000.95951
WirePure metalCopper (Cu)7440-50-80.0738396.550000.33819
Pure metal layerGold (Au)7440-57-50.000270.350000.00123
Palladium (Pd)7440-05-30.002373.100000.01086
subTotal0.07647100.000000.35028
total21.83198100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.