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Chemical content NXB0101GS

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Type numberPackagePackage descriptionTotal product weight
NXB0101GSSOT1202X2SON61.02082 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690917125612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08228100.000008.05977
subTotal0.08228100.000008.05977
ComponentAdditiveNon hazardousProprietary0.000255.000000.02449
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02449
Silica -amorphous-7631-86-90.0025050.000000.24490
PolymerEpoxy resin systemProprietary0.0015030.000000.14694
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04898
subTotal0.00500100.000000.48980
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100038.97720
Magnesium (Mg)7439-95-40.000630.150000.06186
Nickel (Ni)7440-02-00.012422.950001.21662
Silicon (Si)7440-21-30.002690.640000.26394
Pure metal layerGold (Au)7440-57-50.000080.020000.00825
Nickel (Ni)7440-02-00.006901.640000.67636
Palladium (Pd)7440-05-30.000380.090000.03712
subTotal0.42100100.0000041.24135
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.19720
FillerSilica -amorphous-7631-86-90.001420.290000.13949
Silica fused60676-86-00.4230086.1500041.43693
HardenerPhenolic resinProprietary0.021064.290002.06343
PigmentCarbon black1333-86-40.000930.190000.09139
PolymerEpoxy resin systemProprietary0.042578.670004.17015
subTotal0.49100100.0000048.09859
WireGold alloyGold (Au)7440-57-50.0213399.000002.08945
Palladium (Pd)7440-05-30.000221.000000.02111
subTotal0.02154100.000002.11056
total1.02082100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.