×

Chemical content NXB0102GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0102GTSOT833-1XSON82.66060 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690921115612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.25599100.000009.62156
subTotal0.25599100.000009.62156
ComponentAdditiveNon hazardousProprietary0.000755.000000.02819
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02819
Silica -amorphous-7631-86-90.0075050.000000.28189
PolymerEpoxy resin systemProprietary0.0045030.000000.16913
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05638
subTotal0.01500100.000000.56378
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419036.98200
Magnesium (Mg)7439-95-40.001530.145700.05766
Nickel (Ni)7440-02-00.030682.914001.15329
Silicon (Si)7440-21-30.006650.631400.24989
Pure metal layerGold (Au)7440-57-50.000370.035000.01385
Nickel (Ni)7440-02-00.028562.712001.07334
Palladium (Pd)7440-05-30.001260.120000.04749
subTotal1.05300100.0000039.57752
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.20064
FillerSilica -amorphous-7631-86-90.003780.290000.14192
Silica fused60676-86-01.1216786.1500042.15865
HardenerPhenolic resinProprietary0.055864.290002.09937
PigmentCarbon black1333-86-40.002470.190000.09298
PolymerEpoxy resin systemProprietary0.112888.670004.24278
subTotal1.30200100.0000048.93634
WireGold alloyGold (Au)7440-57-50.0342699.000001.28783
Palladium (Pd)7440-05-30.000351.000000.01301
subTotal0.03461100.000001.30084
total2.66060100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.