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Chemical content NXS0101GM

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Type numberPackagePackage descriptionTotal product weight
NXS0101GMSOT886XSON62.00686 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289722115312601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.13857100.000006.90480
subTotal0.13857100.000006.90480
ComponentAdditiveNon hazardousProprietary0.000255.000000.01246
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01246
Silica -amorphous-7631-86-90.0025050.000000.12457
PolymerEpoxy resin systemProprietary0.0015030.000000.07474
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02491
subTotal0.00500100.000000.24914
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100036.35616
Magnesium (Mg)7439-95-40.001160.150000.05770
Nickel (Ni)7440-02-00.022772.950001.13481
Silicon (Si)7440-21-30.004940.640000.24620
Pure metal layerGold (Au)7440-57-50.000150.020000.00769
Nickel (Ni)7440-02-00.012661.640000.63088
Palladium (Pd)7440-05-30.000690.090000.03462
subTotal0.77200100.0000038.46806
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.21778
FillerSilica -amorphous-7631-86-90.003090.290000.15404
Silica fused60676-86-00.9183686.1500045.76099
HardenerPhenolic resinProprietary0.045734.290002.27875
PigmentCarbon black1333-86-40.002030.190000.10092
PolymerEpoxy resin systemProprietary0.092428.670004.60531
subTotal1.06600100.0000053.11779
WireGold alloyGold (Au)7440-57-50.0250499.000001.24758
Palladium (Pd)7440-05-30.000251.000000.01260
subTotal0.02529100.000001.26018
total2.00686100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.