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Chemical content NXS0101GS

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Type numberPackagePackage descriptionTotal product weight
NXS0101GSSOT1202X2SON61.00880 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690898125612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06928100.000006.86805
subTotal0.06928100.000006.86805
ComponentAdditiveNon hazardousProprietary0.000255.000000.02478
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02478
Silica -amorphous-7631-86-90.0025050.000000.24782
PolymerEpoxy resin systemProprietary0.0015030.000000.14869
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04956
subTotal0.00500100.000000.49563
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100039.44162
Magnesium (Mg)7439-95-40.000630.150000.06260
Nickel (Ni)7440-02-00.012422.950001.23112
Silicon (Si)7440-21-30.002690.640000.26709
Pure metal layerGold (Au)7440-57-50.000080.020000.00835
Nickel (Ni)7440-02-00.006901.640000.68442
Palladium (Pd)7440-05-30.000380.090000.03756
subTotal0.42100100.0000041.73276
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.19955
FillerSilica -amorphous-7631-86-90.001420.290000.14115
Silica fused60676-86-00.4230086.1500041.93066
HardenerPhenolic resinProprietary0.021064.290002.08802
PigmentCarbon black1333-86-40.000930.190000.09248
PolymerEpoxy resin systemProprietary0.042578.670004.21984
subTotal0.49100100.0000048.67170
WireGold alloyGold (Au)7440-57-50.0222999.000002.21003
Palladium (Pd)7440-05-30.000231.000000.02232
subTotal0.02252100.000002.23235
total1.00880100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.