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Chemical content NXS0102GT

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Type numberPackagePackage descriptionTotal product weight
NXS0102GTSOT833-1XSON82.66095 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690913115912601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.25599100.000009.62030
subTotal0.25599100.000009.62030
ComponentAdditiveNon hazardousProprietary0.000755.000000.02819
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02819
Silica -amorphous-7631-86-90.0075050.000000.28185
PolymerEpoxy resin systemProprietary0.0045030.000000.16911
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05637
subTotal0.01500100.000000.56371
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419036.97714
Magnesium (Mg)7439-95-40.001530.145700.05766
Nickel (Ni)7440-02-00.030682.914001.15314
Silicon (Si)7440-21-30.006650.631400.24986
Pure metal layerGold (Au)7440-57-50.000370.035000.01385
Nickel (Ni)7440-02-00.028562.712001.07320
Palladium (Pd)7440-05-30.001260.120000.04749
subTotal1.05300100.0000039.57234
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.20061
FillerSilica -amorphous-7631-86-90.003780.290000.14190
Silica fused60676-86-01.1216786.1500042.15310
HardenerPhenolic resinProprietary0.055864.290002.09909
PigmentCarbon black1333-86-40.002470.190000.09297
PolymerEpoxy resin systemProprietary0.112888.670004.24222
subTotal1.30200100.0000048.92989
WireGold alloyGold (Au)7440-57-50.0346199.000001.30049
Palladium (Pd)7440-05-30.000351.000000.01314
subTotal0.03496100.000001.31363
total2.66095100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.