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Chemical content PBSS3540M

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Type numberPackagePackage descriptionTotal product weight
PBSS3540MSOT883 dummy POVXQFN30.87800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340571553151512601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86560
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11925
Phenolic resinProprietary0.0013513.530000.15410
subTotal0.01000100.000001.13895
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.69476
subTotal0.05000100.000005.69476
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.74749
Magnesium (Mg)7439-95-40.000630.146000.07150
Nickel (Ni)7440-02-00.012532.913001.42664
Silicon (Si)7440-21-30.002710.631000.30903
MetallisationGold (Au)7440-57-50.000150.035000.01714
Nickel (Ni)7440-02-00.011852.755001.34926
Palladium (Pd)7440-05-30.000470.110000.05387
subTotal0.43000100.0000048.97493
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.69248
Silica fused60676-86-00.2220060.0000025.28474
Flame retardantMetal hydroxideProprietary0.011103.000001.26424
ImpurityBismuth (Bi)7440-69-90.001850.500000.21071
PigmentCarbon black1333-86-40.001850.500000.21071
PolymerEpoxy resin systemProprietary0.025907.000002.94989
Phenolic resinProprietary0.022206.000002.52847
subTotal0.37000100.0000042.14124
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.13827
subTotal0.01000100.000001.13895
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0080099.990000.91107
subTotal0.00800100.000000.91116
total0.87800100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.